AKAHOSHI, Haruo : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (40)
Les plus populaires
Liste
- Liste
- Tableau

1

Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, Nishimura, Asao

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2007

Langue:

english

Fichier:

PDF, 2.24 MB

english, 2007

2

Efficient oxidative coupling polymerization for synthesis of thermosetting poly(phenylene ether) copolymer with a low dielectric loss

Jun Nunoshige, Haruo Akahoshi, Yuji Shibasaki, Mitsuru Ueda

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Année:

2008

Langue:

english

Fichier:

PDF, 135 KB

english, 2008

3

An Embrittlement Mechanism of Impact Fracture of Sn–Ag–Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes

Yamamoto, Kenichi, Akahoshi, Haruo, Kato, Takahiko, Kawamura, Toshinori, Koizumi, Masahiro, Satoh, Ryohei

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2008

Langue:

english

Fichier:

PDF, 2.43 MB

english, 2008

4

The embrittlement mechanism and improvement of impact strength for lead-free solder joints in BGA packaging using electrolytic Ni/Au plating

Yamamoto, Kenichi, Kato, Takahiko, Kawamura, Toshinori, Nakano, Hiroshi, Koizumi, Masahiro, Akahoshi, Haruo, Satoh, Ryohei

Journal:

Welding International

Année:

2009

Langue:

english

Fichier:

PDF, 1014 KB

english, 2009

5

Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive

Haba, Toshio, Suzuki, Hitoshi, Yoshida, Hiroshi, Akahoshi, Haruo, Chinda, Akira

Journal:

Electrochemical and Solid-State Letters

Année:

2010

Langue:

english

Fichier:

PDF, 427 KB

english, 2010

6

Furan fatty acid as an anti-inflammatory component from the green-lipped mussel Perna canaliculus

Toshiyuki Wakimoto, Hikaru Kondo, Hirohiko Nii, Kaori Kimura, Yoko Egami, Yusuke Oka, Masae Yoshlda, Eri Kida, Yiping Ye, Saeko Akahoshi, Tomohiro Asakawa, Koichi Matsumura, Hitoshi Ishida, Haruo Nuka

Journal:

Proceedings of the National Academy of Sciences

Année:

2011

Langue:

english

Fichier:

PDF, 1024 KB

english, 2011

7

Development of Formaldehyde Free Electroless Copper Plating Solution.

ITABASHI, Takeyuki, AKAHOSHI, Haruo, IIDA, Tadashi, TAKAI, Eiji, NISHIMURA, Naoki

Journal:

Journal of Japan Institute of Electronics Packaging

Année:

2002

Langue:

english

Fichier:

PDF, 828 KB

english, 2002

8

Mechanism of Nodule Formation in Electroless Copper Deposition.

ITABASHI, Takeyuki, AKAHOSHI, Haruo, TAKAHASHI, Akio

Journal:

Circuit Technology

Année:

1994

Fichier:

PDF, 7.70 MB

1994

9

Reaction-induced phase decomposition of thermoset/thermoplastic blends investigated by energy filtering transmission electron microscopy

Yonggui Liao, Shin Horiuchi, Jun Nunoshige, Haruo Akahoshi, Mitsuru Ueda

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 3.30 MB

english, 2007

10

Impedance of a reaction involving two adsorbed intermediates: aluminum dissolution in non-aqueous lithium imide solutions

László Péter, Juichi Arai, Haruo Akahoshi

Journal:

Journal of Electroanalytical Chemistry

Année:

2000

Langue:

english

Fichier:

PDF, 219 KB

english, 2000

11

Adsorption of divalent cations on tin oxide electrodes in aqueous solutions

Isamu Uchida, Haruo Akahoshi, Shinobu Toshima

Journal:

Journal of Electroanalytical Chemistry and Interfacial Electrochemistry

Année:

1978

Langue:

english

Fichier:

PDF, 329 KB

english, 1978

12

Glass-modified stress waves for adhesion measurement of ultra thin films for device applications

Vijay Gupta, Vassili Kireev, Jun Tian, Hiroshi Yoshida, Haruo Akahoshi

Journal:

Journal of the Mechanics and Physics of Solids

Année:

2003

Langue:

english

Fichier:

PDF, 737 KB

english, 2003

13

Changes in Repolarization Properties with Long-Term Cardiac Memory Modify Dispersion of Repolarization in Patients with Wolff-Parkinson-White Syndrome

YASUNOBU TAKADA, YASUYA INDEN, MAKOTO AKAHOSHI, YOSHIHISA SHIBATA, ATSUYA SHIMIZU, YUKIHIKO YOSHIDA, TAKUMI YAMADA, NAOYA TSUBOI, HARUO HIRAYAMA, TERUO ITO, TAKAHISA KONDO, HIDEHIKO SAITO, MAKOTO HIRA

Journal:

Journal of Cardiovascular Electrophysiology

Année:

2002

Langue:

english

Fichier:

PDF, 236 KB

english, 2002

14

Solvation states and properties of binary mixtures of halogenated cyclic carbonates and a linear carbonate

Hideaki Katayama, Juichi Arai, Haruo Akahoshi

Journal:

Journal of Power Sources

Année:

1999

Langue:

english

Fichier:

PDF, 174 KB

english, 1999

15

Localization of Precise Origin of Idiopathic Ventricular Tachycardia from the Right Ventricular Outflow Tract by a 12-Lead ECG: A Study of Pace Mapping Using a Multielectrode “Basket” Catheter

YUKIHIKO YOSHIDA, MAKOTO HIRAI, YOSHIMASA MURAKAMI, TAKAHISA KONDO, YASUYA INDEN, MAKOTO AKAHOSHI, MAKOTO TSUDA, MITSUHIRO OKAMOTO, TAKUMI YAMADA, NAOYA TSUBOI, HARUO HIRAYAMA, TERUO ITO, JUNJI TOYAMA

Journal:

Pacing and Clinical Electrophysiology

Année:

1999

Langue:

english

Fichier:

PDF, 3.53 MB

english, 1999

16

Mechanical and Dielectric Properties of a New Polymer Blend Composed of 1,2-Bis(vinylphenyl)ethane and Thermosetting Poly(phenylene ether) Copolymer Obtained from 2,6-Dimethylphenol and 2-Allyl-6-methylphenol

Nunoshige, Jun, Akahoshi, Haruo, Liao, Yonggui, Horiuchi, Shin, Shibasaki, Yuji, Ueda, Mitsuru

Journal:

Polymer Journal

Année:

2007

Langue:

english

Fichier:

PDF, 269 KB

english, 2007

17

Endoscopic submucosal dissection by using a grasping-type scissors forceps: a preliminary clinical study (with video)

Kazuya Akahoshi, Kuniomi Honda, Hidefumi Akahane, Haruo Akiba, Noriaki Matsui, Yasuaki Motomura, Masaru Kubokawa, Shingo Endo, Naomi Higuchi, Masafumi Oya

Journal:

Gastrointestinal Endoscopy

Année:

2008

Langue:

english

Fichier:

PDF, 914 KB

english, 2008

18

Electrochemical and spectroelectrochemical properties of polyviologen complex modified electrodes

Akahoshi, Haruo, Toshima, Shinobu, Itaya, Kingo

Journal:

Journal of Physical Chemistry

Année:

1981

Langue:

english

Fichier:

PDF, 597 KB

english, 1981

19

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - The Development of an Innovative Process of Large Grained and Low Resistivity Cu Wires for less than hp 45nm ULSI

Tashiro, Suguru, Khoo, Khyoupin, Nagano, Takahiro, Onuki, Jin, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke, Ishikawa, Nobuhiro

Année:

2007

Langue:

english

Fichier:

PDF, 444 KB

english, 2007

20

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Advanced trench filling process by selective copper electrodeposition for ultra fine printed wiring board fabrication

Nakano, Hiroshi, Suzuki, Hitoshi, Haba, Toshio, Yoshida, Hiroshi, Chinda, Akira, Akahoshi, Haruo

Année:

2010

Langue:

english

Fichier:

PDF, 1.04 MB

english, 2010

21

Binary Mixed Solvent Electrolytes Containing Trifluoropropylene Carbonate for Lithium Secondary Batteries

Arai, Juichi, Katayama, Hideaki, Akahoshi, Haruo

Journal:

Journal of The Electrochemical Society

Année:

2002

Langue:

english

Fichier:

PDF, 380 KB

english, 2002

22

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate

Takahiko Kato,, Haruo Akahoshi,, Masato Nakamura,, Tomoaki Hashimoto,, Asao Nishimura,

Année:

2008

Langue:

english

Fichier:

PDF, 648 KB

english, 2008

23

Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke

Journal:

Japanese Journal of Applied Physics

Année:

2006

Langue:

english

Fichier:

PDF, 255 KB

english, 2006

24

Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs

Onuki, Jin, Tashiro, Suguru, Khoo, Khyoupin, Ishikawa, Nobuhiro, Kimura, Takashi, Chonan, Yasunori, Akahoshi, Haruo

Journal:

Journal of The Electrochemical Society

Année:

2010

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2010

25

Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe

Kato, Takahiko, Akahoshi, Haruo, Terasaki, Takeshi, Iwasaki, Tomio, Nakamura, Masato, Hashimoto, Tomoaki, Nishimura, Asao

Journal:

Materials Science Forum

Année:

2007

Langue:

english

Fichier:

PDF, 782 KB

english, 2007

26

Newly Developed Abrasive-free Copper CMP Slurry Based on Electrochemical Analysis

Amanokura, Jin, Mabuchi, Katsumi, Sakurada, Takafumi, Nomura, Yutaka, Habiro, Masanobu, Akahoshi, Haruo

Journal:

MRS Proceedings

Année:

2007

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2007

27

Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure

Chonan, Yasunori, Onuki, Jin, Nagano, Takahiro, Khoo, Khyoupin, Aoyama, Takashi, Akahoshi, Haruo, Haba, Toshio, Saito, Tatsuyuki

Journal:

Japanese Journal of Applied Physics

Année:

2006

Langue:

english

Fichier:

PDF, 238 KB

english, 2006

28

Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Haba, Toshio, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke

Journal:

Japanese Journal of Applied Physics

Année:

2007

Langue:

english

Fichier:

PDF, 334 KB

english, 2007

29

Low Dielectric Loss Copolymer Obtained from 2,6-Dimethylphenol and 2-Allyl-6-methylphenol via Cu-catalyzed Oxidative Coupling Polymerization

Nunoshige, Jun, Akahoshi, Haruo, Shibasaki, Yuji, Ueda, Mitsuru

Journal:

Chemistry Letters

Année:

2007

Langue:

english

Fichier:

PDF, 74 KB

english, 2007

30

Plasma polymerization of hexafluoroethane.

TAKADA, Toshinari, AKAHOSHI, Haruo, TAKAHASHI, Akio

Journal:

KOBUNSHI RONBUNSHU

Année:

1990

Fichier:

PDF, 711 KB

1990

31

Materials-Related Issues for Cu Interconnects Used in Ultra High Speed Large Scaled Integrated Si Devices. Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process.

Haba, Toshio, Itabashi, Takeyuki, Akahoshi, Haruo, Sano, Akihiro, Kobayashi, Kinya, Miyazaki, Hiroshi

Journal:

MATERIALS TRANSACTIONS

Année:

2002

Langue:

english

Fichier:

PDF, 213 KB

english, 2002

32

10.2320/materia.43.28

Kohinata, Shigeru, Fujita, Eiichi, Akahoshi, Haruo, Onuki, Jin

Journal:

Année:

2004

Fichier:

PDF, 4.51 MB

2004

33

10.2320/materia.43.3

Onuki, Jin, Nagano, Takahiro, Koide, Yasuo, Nakatani, Ryoichi, Akahoshi, Haruo

Journal:

Année:

2004

Fichier:

PDF, 1.91 MB

2004

34

Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke

Journal:

MATERIALS TRANSACTIONS

Année:

2007

Langue:

english

Fichier:

PDF, 218 KB

english, 2007

35

Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating

Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Nagano, Takahiro, Akahoshi, Haruo, Itabashi, Takeyuki, Saito, Tatuyuki, Khoo, Khyoupin

Journal:

MATERIALS TRANSACTIONS

Année:

2006

Langue:

english

Fichier:

PDF, 102 KB

english, 2006

36

Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Tashiro, Suguru, Chonan, Yasunori, Akahoshi, Haruo, Haba, Toshio, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke

Journal:

MATERIALS TRANSACTIONS

Année:

2007

Langue:

english

Fichier:

PDF, 207 KB

english, 2007

37

Mechanism fot the Deposition of Electroless Nickel Films on Copper with No Catalyzer.

SUZUKI, Yoshihiro, TAKAHASHI, Akio, AKAHOSHI, Haruo, WAJIMA, Motoyo, NARAHARA, Toshikazu

Journal:

Journal of The Surface Finishing Society of Japan

Année:

1993

Fichier:

PDF, 1.36 MB

1993

38

10.4139/sfj.52.54

SANO, Akihiro, KOBAYASHI, Kinya, AKAHOSHI, Haruo, ITABASHI, Takeyuki, HABA, Toshio, FUKADA, Shinichi, MIYAZAKI, Hiroshi

Journal:

Journal of The Surface Finishing Society of Japan

Année:

2001

Fichier:

PDF, 1.02 MB

2001

39

The Embrittlement Mechanism and Improvement of Impact Strength for Lead-Free Solder Joints in BGA Packages Using Electrolytic Ni/Au Plating

YAMAMOTO, Kenichi, KATO, Takahiko, KAWAMURA, Toshinori, NAKANO, Hiroshi, KOIZUMI, Masahiro, AKAHOSHI, Haruo, SATOH, Ryohei

Journal:

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Année:

2008

Fichier:

PDF, 2.46 MB

2008

40

Effect of Ni Plating Condition on Lead-Free Solder Joints Reliability of BGA Using Electroplated Ni/Au under Impact Load

YAMAMOTO, Kenichi, AKAHOSHI, Haruo, KATO, Takahiko, KAWAMURA, Toshinori, KOIZUMI, Masahiro, KIMOTO, Ryosuke, SATOH, Ryohei

Journal:

Journal of Japan Institute of Electronics Packaging

Année:

2007

Fichier:

PDF, 13.59 MB

2007